Diamond, with its unique properties such as ultra-wide bandgap, ultra-high thermal conductivity, high breakdown field strength, and radiation resistance, is a high-end strategic material in the semiconductor field, serving both as a device material and a heat dissipation function. Its main applications can be categorized as follows:
1. High-end heat dissipation in semiconductors – currently the most mature industrialization direction.
This is currently the fastest-growing application of diamond in the semiconductor field, its core value being solving the heat dissipation bottleneck of high-power chips:
Core application scenarios: Used for heat dissipation in AI chips, high-power GPUs, 5G/6G communication base station power amplifiers, aerospace power devices, and laser diodes. Specific forms include three main categories: diamond substrates, diamond heat sinks, and diamond-copper composite thermal conductive materials. Diamond's thermal conductivity can reach 2000-2500 W/(m·K), more than 5 times that of copper, and it can also match the thermal expansion coefficients of silicon and silicon carbide, avoiding interface failures caused by thermal expansion and contraction.
Industrialization Progress: By 2026, domestically produced liquid cooling solutions had achieved large-scale application of diamond-copper thermal conductive materials. NVIDIA's next-generation GPUs will also adopt a diamond-copper composite heat dissipation solution. The industry predicts that the diamond heat dissipation market in the AI chip field will reach 48-90 billion yuan by 2030.
2. Diamond-based Semiconductor Power Devices-The Core Direction of Next-Generation Power Semiconductors
Diamond itself is an ultra-wide bandgap semiconductor material with performance far exceeding silicon carbide and gallium nitride, and is recognized as the "ultimate power semiconductor material":
